Electromagnetic Band Gap Structure for the Stabilization of Chip Operation in Mobile Devices Hwang Chulsoon

Electromagnetic Band Gap Structure for the Stabilization of Chip Operation in Mobile Devices

Hwang Chulsoon Hwang

The signal via is heavily used in both high-density System-in-Package (SiP)’s and printed circuit board(PCB).’s Furthermore, power ground plane used for low impedance of power distribution network causes cavity noise the caused cavity noise is coupled through the signal via when reference plane of the signal via is exchanged. The coupled cavity noise degrades transition signal quality. In multi-layer board, the high frequency cavity noise is inevitable to reference plane change via . In this paper, reference plane change via analysis in electromagnetic band-gap (EBG) structure is made. EBG structures are used to make ensure return current path of reference plane change via. With ring structure, the mushroom type EBG is used to prevent cavity noise coupling into signal via by suppression cavity resonance near signal via. It is shown that, within the stop band, return current path of via in EBG structure is free from cavity resonance noise. In the presence of EBG structures and slot in power plane, the voltage noise and timing jitter are significantly reduced for random noise source.