Yoo Jeongsik As multiple chips are being integrated into a single package with increased operation frequency, switching noise coupling on power, ground plane have become an important design issue. To reduce the noise coupling, ‘split power plane’ and ‘electromagnetic bandgap (EBG)’ structures have been generally used in package substrates having substrates multilayered power and ground planes. Consequently, there is an increasing need for an efficient method to analyze a split power ground plane in a multilayered package. This paper introduces a hybrid analytical modeling method for characterizing the split power, ground plane and especially about signal via transition trace in a multilayer package. The proposed method uses a resonant cavity model combined with a segmentation method. To verify the proposed method, multilayered test package are fabricated and tested by means of frequency domain measurements. In addition, an optimal power, ground plane design method was successfully demonstrated for suppressing noise coupling between chips on a single package.
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