Session 2: Thursday 8th May 2008

Yoo JeongSik
A Hybrid Analytical Modeling Method for Signal Via Transition Traces in Multi-Layer PCB's
Terahertz Interconnection & Package Laboratory
Department of Electrical Engineering

Hwang ChulSoon
Electromagnetic Band Gap Structures for the Stabilization of Chip Operation in Mobile Devices
Terahertz Interconnection & Package Laboratory
Department of Electrical Engineering




Park SunYoung
Physical Movement and Its Use as a Desgn Element in Enchancing the Emotional Value Of a Product
Collaboration and Interaction Design Laboratory
Department of Industrial Design





Pak JiWoo
3-D Sip (Systems-in-Package) Design and Simulation for T-DMB
Terahertz Interconnection and Package Laboratory
Department of Electrical Engineering






Oktay Yarimaga
SU-8 Layers for Polystyrene and Teflon Releasing Processes: A Qualitative Comparison
Nano Oriented Bio-Electronic Laboratory
Department of Electrical Engineering

Kim BoA
Contextual Awareness for Users in Mobile Culture: A Literature Review
Human Centered Interaction Design Laboratory
Department of Industrial Design




Kim BoRam
Reducing backward radiation of folded dipole antenna by using ground reflector
Radio Frequency System Solution Lab
Department of Electrical Engineering



08may2008